Packaged electroosmotic pumps using porous frits for cooling integrated circuits7,274,106
Capacitor with insulating nanostructure7,271,434
Capacitor with conducting nanostructure7,265,406
Method and device for on-chip decoupling capacitor using nanostructures as bottom7,244,983
Cooling micro-channels7,227,257
Method and apparatus for low temperature copper to copper bonding7,183,648
Self-aligned electrodes contained within the trenches of an electroosmotic pump fabricated in silicon or glass7,105,382
Electroosmotic pumps using porous frits for cooling integrated circuit stacks7,084,495
Methods of forming backside connections on a wafer stack7,056,813
Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack7,056,807
Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration7,037,804
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same7,034,394
Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode6,599,808
Etch stop layer for silicon (si) via etch in three-dimensional (3-d) wafer-to-wafer vertical stack6,645,832
Barrier structure against corrosion and contamination in three-dimensional (3-d) wafer-to-wafer vertical stack6,599,808
Process of vertically stacking multiple wafers supporting different active integrated circuit (ic) devices6,762,076
Thinning techniques for wafer-to-wafer vertical stacks6,790,748
Fabrication of 3-d capacitor with dual damascene process6,790,780
Method and structure for interfacing electronic devices6,870,270
Dielectric recess for wafer-to-wafer and die-to-die bonding and method of fabricating the same6,887,769
Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow6,943,440
Methods of forming backside connections on a wafer stack6,897,125
Ultra-high capacitance device based on nanostructures6,911,373
Etch thinning techniques for wafer-to-wafer vertical stacks6,908,565
Differential Planarization6,914,002
Using external radiators with electroosmotic pumps for cooling integrated circuits6,992,381
Electro-osmotic pumps and micro-channels6,981,849
Thick metal layer integrated process flow to improve power delivery and mechanical buffering6,977,435
Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration and application6,975,016
Korean Patents
3차원 구조물 상 증착 박막을 기반한 실리콘 커패시터 및 그의 제조방법10-2382148
열계면층을 포함하는 반도체 소자 패키지 및 그 제조 방법10-0046514
Low Temperature Cu Bonding method and Low Temperature Cu Bonding package10-2099430
Cu Bonding method by 2 step plasma treatment and Cu Bonding package 10-2142387
Stacked cooling system for semiconductor device using ABL and TSV10-0101228
Manufacturing method for wafer stack to protect wafer edge10-0984848
Stack-type semiconductor package and manufacturing method10-1080343
Manufacturing method for wafer stack10-0936070
Methods of forming thin film solid oxide fuel cell10-0724120
Semiconductor device package comprising thermal interface layer and method of fabricating of the same10-2274190
