• Yoonho Kim
    JCET, Ltd. (Korea)
    dbsgh9157@naver.com
  • Kwangsik Oh
    oksoks98@naver.com
    Samsung Electronics, Inc. (Korea)
  • Seungmin ParK
    evebsm0424@naver.com
    LB Semicon (Korea)
  • Youngjun Park
    pyj909@naver.com
    TBD
  • Haesung Park
    green.leap@daum.net
    Amkor Technology (Korea)
  • Hankyeol Seo
    tjgksruf9801@gmail.com
    Micron Semiconductor Ltd. (Taiwan)
  • Changmin Song
    211×924@naver.com
    Kemsti (Korea)
  • Seungbum Cho
    mcdivice@naver.com
    TSE, Ltd. (Korea)
  • Yonghyun Won
    dnjsdyd1989@naver.com
    Applied Materials, Inc. (Korea)
  • Cheol Kim
    ckim05137@gmail.com
    Samsung Electronics, Inc. (Korea)
  • Junsung Ma
    matssang0703@naver.com
    Nepes (Korea)
  • Manseok Park
    arkmain001@gmail.com
    Seoul Technopark (Korea)
  • Joseph Um
    traujs@nate.com
    Lam Research (US)
  • Byung-Min Rho
    rohroh1@nate.com
    University of Oklahoma (US)
  • Kyung-Hwan Oh
    ohbaksa1218@gmail.com
    NYU (US)
  • Youngmo Gu
    ymkoo@epworks.co.kr
    Hana-EP Works (Korea)
  • Joon-Hyuk Jang
    shine_to_me@naver.com
    SK Hynix (Korea)
  • Youngrae Kim
    a27742140@gmail.com
    Micron Semiconductor Ltd. (Taiwan)
  • Sunphil Kim
    rlatjsvlf8@naver.com
    Western Digital (US)
  • Mi-Kyung Choi
    choimik@amkor.ac.kr
    Amkor Technology (Korea)