Publications

2025
  • 2025 MRX C2H4 Reductive Plasma Treatment on Copper Surface for Copper Bonding D. Lee H. Lee J. Choi S. Jang S. E. Kim
  • 2025 EML Effect of Ar/N2 Two-Step Plasma Treatments on the Interfacial Characteristics of Low Temperature Cu-Cu Direct Bonding G. Kim S. Choi Y. Kwon S. E. Kim H. Lee Y. Park
  • 2025 Appl. Sci. Layout Design Strategies for Scaling Down Semiconductor Systems Based on Current Flow Analysis in Interconnect S. H. Oh T. Y. Hong S. E. Kim J. K. Park S. K. Hong
  • 2025 JSTS Characteristics of PVD SiCN for Application in Hybrid Cu Bonding J. Choi S. Jang D. Lee S. Kang S. Kim S. E. Kim
  • 2025 IEEE ACCESS Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application S. Park S. Lee J. Choi S. E. Kim
  • 2025 IEEE TCPMT Effects of Au passivation thickness on improving low-temperature Cu-to-Cu bonding interface S. Lee J. Song S. Park S. E. Kim
2024
  • 2024 micromachines Analysis of Signal Transmission Efficiency in Semiconductor Interconnect and Proposal of Enhanced Structures T. Y. Hong S. E. Kim S. K. Hong
  • 2024 IEEE TCPMT Two-Step Ar/N2 Plasma Treatment on SiO2 Surface for Cu/SiO2 Hybrid Bonding S. Park S. Lee S. E. Kim
  • 2024 IEEE ACCESS First Demonstration of Enhanced Cu-Cu Bonding at Low Temperature With Ruthenium Passivation Layer S. Park S. Hong S. E. Kim J. Park
  • 2024 Scientific Reports Unraveling diffusion behavior in Cu‑to‑Cu direct bonding with metal passivation layers M. Jeong S. Park Y. Kim J. Kim S. Hong S. E. Kim J. Park
  • 2024 Applied Sciences Low-Temperature Diffusion of Au and Ag Nanolayers for Cu Bonding S. Lee S. Park S. E. Kim
2023
  • 2023 electronics Guidelines for Area Ratio between Metal Lines and Vias to Improve the Reliability of Interconnect Systems in High-Density Electronic Devices T. Hong S. E. Kim J. Park S. Hong
  • 2023 IEEE TCPMT Effect of the annealing process on Cu bonding quality using Ag nanolayer Y. Kim S. E. Kim
  • 2023 Microelectronic Engineering Nano-capsuled thermal interface materials filler using defective multilayered graphene-coated silver nanoparticles S. Choi D. Shin S. E. Kim C. Lee
  • 2023 Electronic Materials Letters Copper Bonding Technology in Heterogeneous Integration Y. Lee M. Mclnerney Y. Yoo I. Choi S. E. Kim
  • 2023 IEEE TCPMT Thermo-Mechanical Challenges of 2.5D Packaging: A Review of Warpage and Interconnect Reliability H. Kim J. Hwang S. E. Kim Y. Joo H. Jang
  • 2023 EML Copper Bonding Technology in Heterogeneous Integration Y. Lee M. McInerney Y. Joo I. Choi S. E. Kim
2022
  • 2022 Appl. Sci. A Review of Cell Operation Algorithm for 3D NAND Flash Memory J. K. Park S. E. Kim
  • 2022 Journal of Electronic Materials Low temperature diffusion behavior of Ti in Cu/Ti-Ti/Cu bonding S. Park Y. Kim S. E. Kim
  • 2022 Applied Surface Science Fabrication of multilayer Graphene-coated Copper nanoparticles for application as a thermal interface material D. Shin S. Choi S. E. Kim C. Yun Y. Tan C. S. Lee
  • 2022 J. Microelectron. Packag. Soc. Evaluation of 12nm Ti layer for low temperature Cu-Cu bonding S. Park Y. Kim S. E. Kim
2021
  • 2021 Electronic Materials Letters Characteristics of Copper Nitride Nanolayer Used in 3D Cu Bonding Interconnects H. Park H. Seo S. E. Kim
  • 2021 IEEE Transactions on Components, Packaging and Manufacturing Technology Low-Temperature (260°C) Solderless Cu–Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration H. Park H. Seo Y. Kim S. Park S. E. Kim
  • 2021 J. Microelectron. Packag. Soc. Effect of Ag Nanolayer in Low Temperature Cu/Ag-Ag/Cu Bonding Y. Kim S. Park S. E. Kim
  • 2021 J. Microelectron. Packag. Soc. Effects of Ar/N2 Two-step Plasma Treatment on the Quantitative Interfacial Adhesion Energy of Low-Temperature Cu-Cu Bonding Interface S. Choi G. Kim H. Seo S. E. Kim Y. Park
2020
  • 2020 Scientific Reports Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper-copper bonding H. Park H. Seo S. E. Kim
  • 2020 IEEE Transactions on Components, Packaging and Manufacturing Comprelensive analysis of a Cu nitride passivated surface that enhances Cu-to-cu bonding H. Seo H. Park S. E. Kim
  • 2020 IEEE Transactions on Components, Packaging and Manufacturing Two-step plasma treatment on copper surface for low temperature Cu thermo-compression bonding H. Park S. E. Kim
  • 2020 Proc. IEEE ECTC Effects of two-step plasma treatment on Cu and SiO2 surfaces for 3D bonding applications H. Seo H. Park G. Jim Y. B. Park S. E. Kim
  • 2020 Proc. IEEE ECTC Development of CMOS-compatible low temperature Cu bonding optimized by the response surface methodology H. Park H. Seo M. Park S. E. Kim
  • 2020 J. Microelectron. & Packag. Soc. Cu-SiO2 hybrid bonding H. Seo H. Park S. E. Kim
  • 2020 J. Microelectron. & Packag. Soc. Bonding strength evaluation of copper bonding using copper nitride layer H. Park H. Park G. Kim Y. B. Park S. E. Kim
2019
  • 2019 Microsystem Technologies Nitrogen passivation formation on Cu surface by Ar–N2 plasma for Cu-to-Cu wafer stacking application H. Park S. E. Kim
  • 2019 Applied Sciences Two-step plasma treatment on sputtered and electroplated Cu surfaces for Cu-to-Cu bonding application H.l Seo H. Park S. E. Kim
  • 2019 Microsystem Technologies Process and characterization of photo-definable organic-inorganic dielectric for wafer level packaging C. Song S. E. Kim
  • 2019 J. Microelectron. & Packag. Soc. Analysis of Ar Plasma Effects for Copper Nitride Passivation Formation via Design of Experiment C. Song S. E. Kim
2018
  • 2018 Microsystem Technologies Nitrogen passivation formation on Cu surface by Ar-N2 plasma for Cu-to-Cu wafer stacking application H. Park and S. E. Kim
  • 2018 Nanoscience and Nanotechnology Letters Assessment of spin-on-glass for fan-out wafer level packaging with multilayer interconnects C. Song S. Kim and S. E. Kim
  • 2018 Advances in Materials Fabrication of tin oxide thin film transistors by RF magnetron sputtering using Sn/SnO composite target C. Kim S. E. Kim
  • 2018 Proc. IEEE ECTC 2018 (Scopus) Fabrication and characteristics of spin-on dielectric for multi-level interconnect in WLP C. Song S. Kim and S. E. Kim
  • 2018 J. Microelectron. & Packag. Soc. Structural Characteristics of Ar-N2 Plasma Treatment on Cu Surface H. Park and S. E. Kim
  • 2018 J. Microelectron. & Packag. Soc. Study oStudy of Organic-inorganic Hybrid Dielectric for the use of Redistribution Layers in Fan-out Wafer Level Packaging C. Song and S. E. Kim
  • 2018 J. Microelectron. & Packag. Soc. Effect of Si grinding on electrical properties of sputtered tin oxide thin films S. Cho and S. E. Kim
  • 2018 J. Microelectron. & Packag. Soc. Organic-inorganic Hybrid Dielectric with UV Patterning and UV Curing for Global Interconnect Applications C. Song H. Park H. Seo S. E. Kim
2017
  • 2017 ECS Journal of Solid State Science and Technology Comparative Analysis of SnOx Thin Films Deposited by RF Reactive Sputtering with Different SnO/Sn Target Compositions C. Kim S. Kim and S. E. Kim
  • 2017 J. Microelectron. & Packag. Soc. On-chip Decoupling Capacitor for Power Integrity S. Cho and S. E. Kim
  • 2017 J. Microelectron. & Packag. Soc. Effect of coolants and metal bumps on the heat removal of liquid cooled microchannel system Y. Won S. Kim S. E. Kim
  • 2017 J. Microelectron. & Packag. Soc. Study of the effect of vacuum annealing on sputtered SnxOy thin films by SnO/Sn composite target C. Kim S. Cho S. Kim and S. E. Kim
  • 2017 Thin Solid Films Transparent SnOx thin films fabricated by rf reactive sputtering with SnO/Sn composite target C. Kim S. Kim and S. E. Kim
  • 2017 Microsyst. Technol Evaluation of Si liquid cooling structure with microchannel and TSV for 3D application M. Park S. Kim S. E. Kim
2016
  • 2016 Kor. J. Mater. Res. Analysis of sputter-deposited SnO thin film with SnO/Sn composite target C. Kim S. Kim and S. E. Kim
  • 2016 Japanese J. Applied Physics Experimental assessment of on-chip liquid cooling through micro-channel with DI water and diluted ethylene glycol Y. Won S. Kim S. E. Kim
  • 2016 J. Microelectron. & Packag. Soc. Heterogeneous Device Packaging Technology for the Internet of Things Applications S. E. Kim
  • 2016 Japanese J. Applied Physics Effects of forming gas plasma treatment on low-temperature Cu–Cu direct S. Kim Y. Nam S. E. Kim
  • 2016 J. Nanoparticle Research Exploring the intellectual structure of nanoscience and nanotechnology: journal citation network analysis H. Jo Y. Park S. E. Kim H. Lee
  • 2016 Microelectronic Eng. Thermal Assessment of Copper Through Silicon Via in 3D IC Y. Shin S. E. kim S. Kim
  • 2016 J. Microelectron. & Packag. Soc. IC Thermal Management Using Microchannel Liquid Cooling Structure with Various Metal Bumps Y. Won S. Kim S. E. Kim
2015
  • 2015 Appl. Sur. Sci. Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics M. Park S. Back S. Kim S. E. Kim
  • 2015 J. Microelectron. & Packag. Soc. Study of On-chip Liquid Cooling in Relation to Micro-channel Design Y. Won S. Kim and S. E. Kim
  • 2015 J. Microelectron. & Packag. Soc. Study of Chip-level Liquid Cooling for High-heat-flux Devices M. Park S. Kim and S. E. Kim
  • 2015 Microelectron. Eng. Wafer level Cu-Cu direct bonding for 3D integration S. E. Kim and S. Kim
2014
  • 2014 Microelectron. Reliab. Characterization of flip chip bonded structure with Cu ABL power bumps J. Ma S. Kim S. E. Kim
  • 2014 ECS Solid State Letters Homo-junction pn diode using p-type SnO and n-type SnO thin films J. Um S. E. Kim
  • 2014 J. Microelectron. & Packag. Soc. Bumpless interconnect system for fine-pitch devices S. E. Kim
  • 2014 J. Microelectron. & Packag. Soc. Study of micro flip chip process using ABL bumps J. Ma S. Kim and S. E. Kim
  • 2014 Microelectronic Eng. The Effects of Cu TSV on the Thermal Conduction in 3D Stacked IC J. Ma S. E. Kim and S. Kim