Publications

2025
  • 2025 JSTS Characteristics of PVD SiCN for Application in Hybrid Cu Bonding J. Choi S. Jang D. Lee S. Kang S. Kim S. E. Kim
  • 2025 IEEE ACCESS Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application S. Park S. Lee J. Choi S. E. Kim
  • 2025 IEEE TCPMT Effects of Au passivation thickness on improving low-temperature Cu-to-Cu bonding interface S. Lee J. Song S. Park S. E. Kim
2024
  • 2024 micromachines Analysis of Signal Transmission Efficiency in Semiconductor Interconnect and Proposal of Enhanced Structures T. Y. Hong S. E. Kim S. K. Hong
  • 2024 IEEE TCPMT Two-Step Ar/N2 Plasma Treatment on SiO2 Surface for Cu/SiO2 Hybrid Bonding S. Park S. Lee S. E. Kim
  • 2024 IEEE ACCESS First Demonstration of Enhanced Cu-Cu Bonding at Low Temperature With Ruthenium Passivation Layer S. Park S. Hong S. E. Kim J. Park
  • 2024 Scientific Reports Unraveling diffusion behavior in Cu‑to‑Cu direct bonding with metal passivation layers M. Jeong S. Park Y. Kim J. Kim S. Hong S. E. Kim J. Park
  • 2024 Applied Sciences Low-Temperature Diffusion of Au and Ag Nanolayers for Cu Bonding S. Lee S. Park S. E. Kim
2023
  • 2023 electronics Guidelines for Area Ratio between Metal Lines and Vias to Improve the Reliability of Interconnect Systems in High-Density Electronic Devices T. Hong S. E. Kim J. Park S. Hong
  • 2023 IEEE TCPMT Effect of the annealing process on Cu bonding quality using Ag nanolayer Y. Kim S. E. Kim
  • 2023 Microelectronic Engineering Nano-capsuled thermal interface materials filler using defective multilayered graphene-coated silver nanoparticles S. Choi D. Shin S. E. Kim C. Lee
  • 2023 Electronic Materials Letters Copper Bonding Technology in Heterogeneous Integration Y. Lee M. Mclnerney Y. Yoo I. Choi S. E. Kim
  • 2023 IEEE TCPMT Thermo-Mechanical Challenges of 2.5D Packaging: A Review of Warpage and Interconnect Reliability H. Kim J. Hwang S. E. Kim Y. Joo H. Jang
  • 2023 EML Copper Bonding Technology in Heterogeneous Integration Y. Lee M. McInerney Y. Joo I. Choi S. E. Kim
2022
  • 2022 Appl. Sci. A Review of Cell Operation Algorithm for 3D NAND Flash Memory J. K. Park S. E. Kim
  • 2022 Journal of Electronic Materials Low temperature diffusion behavior of Ti in Cu/Ti-Ti/Cu bonding S. Park Y. Kim S. E. Kim
  • 2022 Applied Surface Science Fabrication of multilayer Graphene-coated Copper nanoparticles for application as a thermal interface material D. Shin S. Choi S. E. Kim C. Yun Y. Tan C. S. Lee
  • 2022 J. Microelectron. Packag. Soc. Evaluation of 12nm Ti layer for low temperature Cu-Cu bonding S. Park Y. Kim S. E. Kim
2021
  • 2021 Electronic Materials Letters Characteristics of Copper Nitride Nanolayer Used in 3D Cu Bonding Interconnects H. Park H. Seo S. E. Kim
  • 2021 IEEE Transactions on Components, Packaging and Manufacturing Technology Low-Temperature (260°C) Solderless Cu–Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration H. Park H. Seo Y. Kim S. Park S. E. Kim
  • 2021 J. Microelectron. Packag. Soc. Effect of Ag Nanolayer in Low Temperature Cu/Ag-Ag/Cu Bonding Y. Kim S. Park S. E. Kim
  • 2021 J. Microelectron. Packag. Soc. Effects of Ar/N2 Two-step Plasma Treatment on the Quantitative Interfacial Adhesion Energy of Low-Temperature Cu-Cu Bonding Interface S. Choi G. Kim H. Seo S. E. Kim Y. Park
2020
  • 2020 Scientific Reports Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper-copper bonding H. Park H. Seo S. E. Kim
  • 2020 IEEE Transactions on Components, Packaging and Manufacturing Comprelensive analysis of a Cu nitride passivated surface that enhances Cu-to-cu bonding H. Seo H. Park S. E. Kim
  • 2020 IEEE Transactions on Components, Packaging and Manufacturing Two-step plasma treatment on copper surface for low temperature Cu thermo-compression bonding H. Park S. E. Kim
  • 2020 Proc. IEEE ECTC Effects of two-step plasma treatment on Cu and SiO2 surfaces for 3D bonding applications H. Seo H. Park G. Jim Y. B. Park S. E. Kim
  • 2020 Proc. IEEE ECTC Development of CMOS-compatible low temperature Cu bonding optimized by the response surface methodology H. Park H. Seo M. Park S. E. Kim
  • 2020 J. Microelectron. & Packag. Soc. Cu-SiO2 hybrid bonding H. Seo H. Park S. E. Kim
  • 2020 J. Microelectron. & Packag. Soc. Bonding strength evaluation of copper bonding using copper nitride layer H. Park H. Park G. Kim Y. B. Park S. E. Kim
2019
  • 2019 Microsystem Technologies Nitrogen passivation formation on Cu surface by Ar–N2 plasma for Cu-to-Cu wafer stacking application H. Park S. E. Kim
  • 2019 Applied Sciences Two-step plasma treatment on sputtered and electroplated Cu surfaces for Cu-to-Cu bonding application H.l Seo H. Park S. E. Kim
  • 2019 Microsystem Technologies Process and characterization of photo-definable organic-inorganic dielectric for wafer level packaging C. Song S. E. Kim
  • 2019 J. Microelectron. & Packag. Soc. Analysis of Ar Plasma Effects for Copper Nitride Passivation Formation via Design of Experiment C. Song S. E. Kim
2018
  • 2018 Microsystem Technologies Nitrogen passivation formation on Cu surface by Ar-N2 plasma for Cu-to-Cu wafer stacking application H. Park and S. E. Kim
  • 2018 Nanoscience and Nanotechnology Letters Assessment of spin-on-glass for fan-out wafer level packaging with multilayer interconnects C. Song S. Kim and S. E. Kim
  • 2018 Advances in Materials Fabrication of tin oxide thin film transistors by RF magnetron sputtering using Sn/SnO composite target C. Kim S. E. Kim
  • 2018 Proc. IEEE ECTC 2018 (Scopus) Fabrication and characteristics of spin-on dielectric for multi-level interconnect in WLP C. Song S. Kim and S. E. Kim
  • 2018 J. Microelectron. & Packag. Soc. Structural Characteristics of Ar-N2 Plasma Treatment on Cu Surface H. Park and S. E. Kim
  • 2018 J. Microelectron. & Packag. Soc. Study oStudy of Organic-inorganic Hybrid Dielectric for the use of Redistribution Layers in Fan-out Wafer Level Packaging C. Song and S. E. Kim
  • 2018 J. Microelectron. & Packag. Soc. Effect of Si grinding on electrical properties of sputtered tin oxide thin films S. Cho and S. E. Kim
  • 2018 J. Microelectron. & Packag. Soc. Organic-inorganic Hybrid Dielectric with UV Patterning and UV Curing for Global Interconnect Applications C. Song H. Park H. Seo S. E. Kim
2017
  • 2017 ECS Journal of Solid State Science and Technology Comparative Analysis of SnOx Thin Films Deposited by RF Reactive Sputtering with Different SnO/Sn Target Compositions C. Kim S. Kim and S. E. Kim
  • 2017 J. Microelectron. & Packag. Soc. On-chip Decoupling Capacitor for Power Integrity S. Cho and S. E. Kim
  • 2017 J. Microelectron. & Packag. Soc. Effect of coolants and metal bumps on the heat removal of liquid cooled microchannel system Y. Won S. Kim S. E. Kim
  • 2017 J. Microelectron. & Packag. Soc. Study of the effect of vacuum annealing on sputtered SnxOy thin films by SnO/Sn composite target C. Kim S. Cho S. Kim and S. E. Kim
  • 2017 Thin Solid Films Transparent SnOx thin films fabricated by rf reactive sputtering with SnO/Sn composite target C. Kim S. Kim and S. E. Kim
  • 2017 Microsyst. Technol Evaluation of Si liquid cooling structure with microchannel and TSV for 3D application M. Park S. Kim S. E. Kim
2016
  • 2016 Kor. J. Mater. Res. Analysis of sputter-deposited SnO thin film with SnO/Sn composite target C. Kim S. Kim and S. E. Kim
  • 2016 Japanese J. Applied Physics Experimental assessment of on-chip liquid cooling through micro-channel with DI water and diluted ethylene glycol Y. Won S. Kim S. E. Kim
  • 2016 J. Microelectron. & Packag. Soc. Heterogeneous Device Packaging Technology for the Internet of Things Applications S. E. Kim
  • 2016 Japanese J. Applied Physics Effects of forming gas plasma treatment on low-temperature Cu–Cu direct S. Kim Y. Nam S. E. Kim
  • 2016 J. Nanoparticle Research Exploring the intellectual structure of nanoscience and nanotechnology: journal citation network analysis H. Jo Y. Park S. E. Kim H. Lee
  • 2016 Microelectronic Eng. Thermal Assessment of Copper Through Silicon Via in 3D IC Y. Shin S. E. kim S. Kim
  • 2016 J. Microelectron. & Packag. Soc. IC Thermal Management Using Microchannel Liquid Cooling Structure with Various Metal Bumps Y. Won S. Kim S. E. Kim
2015
  • 2015 Appl. Sur. Sci. Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics M. Park S. Back S. Kim S. E. Kim
  • 2015 J. Microelectron. & Packag. Soc. Study of On-chip Liquid Cooling in Relation to Micro-channel Design Y. Won S. Kim and S. E. Kim
  • 2015 J. Microelectron. & Packag. Soc. Study of Chip-level Liquid Cooling for High-heat-flux Devices M. Park S. Kim and S. E. Kim
  • 2015 Microelectron. Eng. Wafer level Cu-Cu direct bonding for 3D integration S. E. Kim and S. Kim
2014
  • 2014 Microelectron. Reliab. Characterization of flip chip bonded structure with Cu ABL power bumps J. Ma S. Kim S. E. Kim
  • 2014 ECS Solid State Letters Homo-junction pn diode using p-type SnO and n-type SnO thin films J. Um S. E. Kim
  • 2014 J. Microelectron. & Packag. Soc. Bumpless interconnect system for fine-pitch devices S. E. Kim
  • 2014 J. Microelectron. & Packag. Soc. Study of micro flip chip process using ABL bumps J. Ma S. Kim and S. E. Kim
  • 2014 Microelectronic Eng. The Effects of Cu TSV on the Thermal Conduction in 3D Stacked IC J. Ma S. E. Kim and S. Kim