Electronic Systems Laboratory

2022 Appl. Sci. A Review of Cell Operation Algorithm for 3D NAND Flash Memory J. K. Park S. E. Kim
2022 Journal of Electronic Materials Low temperature diffusion behavior of Ti in Cu/Ti-Ti/Cu bonding S. Park Y. Kim S. E. Kim
2022 Applied Surface Science Fabrication of multilayer Graphene-coated Copper nanoparticles for application as a thermal interface material D. Shin S. Choi S. E. Kim C. Yun Y. Tan C. S. Lee
2022 J. Microelectron. Packag. Soc. Evaluation of 12nm Ti layer for low temperature Cu-Cu bonding S. Park Y. Kim S. E. Kim

2021 Electronic Materials Letters Characteristics of Copper Nitride Nanolayer Used in 3D Cu Bonding Interconnects H. Park H. Seo S. E. Kim
2021 IEEE Transactions on Components, Packaging and Manufacturing Technology Low-Temperature (260°C) Solderless Cu–Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration H. Park H. Seo Y. Kim S. Park S. E. Kim
2021 J. Microelectron. Packag. Soc. Effect of Ag Nanolayer in Low Temperature Cu/Ag-Ag/Cu Bonding Y. Kim S. Park S. E. Kim
2021 J. Microelectron. Packag. Soc. Effects of Ar/N₂ Two-step Plasma Treatment on the Quantitative Interfacial Adhesion Energy of Low-Temperature Cu-Cu Bonding Interface S. Choi G. Kim H. Seo S. E. Kim Y. Park

2020 Scientific Reports Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper-copper bonding H. Park H. Seo S. E. Kim
2020 IEEE Transactions on Components, Packaging and Manufacturing Comprelensive analysis of a Cu nitride passivated surface that enhances Cu-to-cu bonding H. Seo H. Park S. E. Kim
2020 IEEE Transactions on Components, Packaging and Manufacturing Two-step plasma treatment on copper surface for low temperature Cu thermo-compression bonding H. Park S. E. Kim
2020 Proc. IEEE ECTC Effects of two-step plasma treatment on Cu and SiO2 surfaces for 3D bonding applications H. Seo H. Park G. Jim Y. B. Park S. E. Kim
2020 Proc. IEEE ECTC Development of CMOS-compatible low temperature Cu bonding optimized by the response surface methodology H. Park H. Seo M. Park S. E. Kim
2020 J. Microelectron. & Packag. Soc. Cu-SiO2 hybrid bonding H. Seo H. Park S. E. Kim
2020 J. Microelectron. & Packag. Soc. Bonding strength evaluation of copper bonding using copper nitride layer H. Park H. Park G. Kim Y. B. Park S. E. Kim

2019 Microsystem Technologies Nitrogen passivation formation on Cu surface by Ar–N2 plasma for Cu-to-Cu wafer stacking application H. Park S. E. Kim
2019 Applied Sciences Two-step plasma treatment on sputtered and electroplated Cu surfaces for Cu-to-Cu bonding application H.l Seo H. Park S. E. Kim
2019 Microsystem Technologies Process and characterization of photo-definable organic-inorganic dielectric for wafer level packaging C. Song S. E. Kim
2019 J. Microelectron. & Packag. Soc. Analysis of Ar Plasma Effects for Copper Nitride Passivation Formation via Design of Experiment C. Song S. E. Kim

2018 Microsystem Technologies Nitrogen passivation formation on Cu surface by Ar-N2 plasma for Cu-to-Cu wafer stacking application H. Park and S. E. Kim
2018 Nanoscience and Nanotechnology Letters Assessment of spin-on-glass for fan-out wafer level packaging with multilayer interconnects C. Song S. Kim and S. E. Kim
2018 Advances in Materials Fabrication of tin oxide thin film transistors by RF magnetron sputtering using Sn/SnO composite target C. Kim S. E. Kim
2018 Proc. IEEE ECTC 2018 (Scopus) Fabrication and characteristics of spin-on dielectric for multi-level interconnect in WLP C. Song S. Kim and S. E. Kim
2018 J. Microelectron. & Packag. Soc. Structural Characteristics of Ar-N2 Plasma Treatment on Cu Surface H. Park and S. E. Kim
2018 J. Microelectron. & Packag. Soc. Study oStudy of Organic-inorganic Hybrid Dielectric for the use of Redistribution Layers in Fan-out Wafer Level Packaging C. Song and S. E. Kim
2018 J. Microelectron. & Packag. Soc. Effect of Si grinding on electrical properties of sputtered tin oxide thin films S. Cho and S. E. Kim
2018 J. Microelectron. & Packag. Soc. Organic-inorganic Hybrid Dielectric with UV Patterning and UV Curing for Global Interconnect Applications C. Song H. Park H. Seo S. E. Kim

2017 ECS Journal of Solid State Science and Technology Comparative Analysis of SnOx Thin Films Deposited by RF Reactive Sputtering with Different SnO/Sn Target Compositions C. Kim S. Kim and S. E. Kim
2017 J. Microelectron. & Packag. Soc. On-chip Decoupling Capacitor for Power Integrity S. Cho and S. E. Kim
2017 J. Microelectron. & Packag. Soc. Effect of coolants and metal bumps on the heat removal of liquid cooled microchannel system Y. Won S. Kim S. E. Kim
2017 J. Microelectron. & Packag. Soc. Study of the effect of vacuum annealing on sputtered SnxOy thin films by SnO/Sn composite target C. Kim S. Cho S. Kim and S. E. Kim
2017 Thin Solid Films Transparent SnOx thin films fabricated by rf reactive sputtering with SnO/Sn composite target C. Kim S. Kim and S. E. Kim
2017 Microsyst. Technol Evaluation of Si liquid cooling structure with microchannel and TSV for 3D application M. Park S. Kim S. E. Kim

2016 Kor. J. Mater. Res. Analysis of sputter-deposited SnO thin film with SnO/Sn composite target C. Kim S. Kim and S. E. Kim
2016 Japanese J. Applied Physics Experimental assessment of on-chip liquid cooling through micro-channel with DI water and diluted ethylene glycol Y. Won S. Kim S. E. Kim
2016 J. Microelectron. & Packag. Soc. Heterogeneous Device Packaging Technology for the Internet of Things Applications S. E. Kim
2016 Japanese J. Applied Physics Effects of forming gas plasma treatment on low-temperature Cu–Cu direct S. Kim Y. Nam S. E. Kim
2016 J. Nanoparticle Research Exploring the intellectual structure of nanoscience and nanotechnology: journal citation network analysis H. Jo Y. Park S. E. Kim H. Lee
2016 Microelectronic Eng. Thermal Assessment of Copper Through Silicon Via in 3D IC Y. Shin S. E. kim S. Kim
2016 J. Microelectron. & Packag. Soc. IC Thermal Management Using Microchannel Liquid Cooling Structure with Various Metal Bumps Y. Won S. Kim S. E. Kim

2015 Appl. Sur. Sci. Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics M. Park S. Back S. Kim S. E. Kim
2015 J. Microelectron. & Packag. Soc. Study of On-chip Liquid Cooling in Relation to Micro-channel Design Y. Won S. Kim and S. E. Kim
2015 J. Microelectron. & Packag. Soc. Study of Chip-level Liquid Cooling for High-heat-flux Devices M. Park S. Kim and S. E. Kim
2015 Microelectron. Eng. Wafer level Cu-Cu direct bonding for 3D integration S. E. Kim and S. Kim

2014 Microelectron. Reliab. Characterization of flip chip bonded structure with Cu ABL power bumps J. Ma S. Kim S. E. Kim
2014 ECS Solid State Letters Homo-junction pn diode using p-type SnO and n-type SnO thin films J. Um S. E. Kim
2014 J. Microelectron. & Packag. Soc. Bumpless interconnect system for fine-pitch devices S. E. Kim
2014 J. Microelectron. & Packag. Soc. Study of micro flip chip process using ABL bumps J. Ma S. Kim and S. E. Kim
2014 Microelectronic Eng. The Effects of Cu TSV on the Thermal Conduction in 3D Stacked IC J. Ma S. E. Kim and S. Kim