2026

• H. Lee B. Go S. E. Kim Simultaneous Surface Reduction and Self-Passivation via Ar-CH₄ Plasma for Low-Temperature Cu Bonding ICOS 2026
• B. Go H. Lee K. Komamura T. Kishida S. E. Kim Comparative Study of Electroless and Electroplated Au Passivation for Low-Temperature Hybrid Cu Bonding ICOS 2026

2025

• S. Jang J. Choi S. E. Kim Polymer-Dependent Fly Cutting Process and Its Influence on Cu/Polymer Hybrid Bonding ISMP 2025
• J. Choi S. Jang H. Lee S. E. Kim Sputter-Engineered PVD SiCN as a Low-k Dielectric for Hybrid Cu Bonding ISMP 2025
• H. Lee B. Chan S. E. Kim Advanced Cu Surface Modification Using Ar-CH₄ Plasma Pre-treatment for Direct Cu-to-Cu Bonding ISMP 2025
• B. Chan D. Lee K. Komamura S. E. Kim Electroless Au Passivation for Oxidation-Free Cu–Cu Bonding ISMP 2025
• S. Kim K. Seo J. Choi S. Jang D. Lee S. E. Kim Geometry-Driven Effects of Cu Dishing and Cu Bonding Interface Integrity ISMP 2025
• S. Jang J. Choi D. Lee H. Lee S. E. Kim Evaluation of Fly Cutting for Planarization in Cu/Polymer Hybrid Bonding and Its Effects on Polymer Materials and Processing Conditions ICEPT 2025
• J. Choi S. Jang D. Lee H. Lee S. E. Kim Study on the deposition and low-temperature bonding of PVD SiCN thin film ICEPT 2025
• S. Kim K. Seo J. Choi S. Jang D. Lee H. Lee S. E. Kim Study on Cu Dishing in CMP Process and Its Impact on Hybrid Bonding by Pad Size ICEPT 2025
• H. Lee D. Lee S. Jang J. Choi S. E. Kim Effect of CH₄ Plasma Pretreatment on Cu-to-Cu Bonding Applications ICEPT 2025
• D. Lee J. Choi S. Jang H. Lee K. Komamura S. E. Kim Effect of Palladium Passivation via Electroplating and Electroless Plating on Low-Temperature Cu-to-Cu Bonding ICEPT 2025
• S. Jang JJ. Choi D. Lee H. Lee S. E. Kim Optimization of Fly Cutting Process for Cu/Polyimide Hybrid Bonding KCS 2025
• J. Choi S. Jang D. Lee H. Lee S. E. Kim Characterization of PVD SiCN Thin Films for Chip Stacking KCS 2025
• S. kim,.K. Seo H. Lee S. Park S. E. Kim Study of Cu Dishing After Cu CMP Based on Pad Layouts and Its Impact on Hybrid Bonding KCS 2025
• D. Lee H. Lee J. Choi S. Jang S. E. Kim Study of Low Temperature Cu-to-Cu Bonding using Reducing Plasma Pretreatment KCS 2025
• D. Lee J. Choi S. Jang H. Lee S. E. Kim Effect of Noble Metal Passivation Deposited by ECD on Cu Surface for Low-Temperature Cu-to-Cu Bonding IEEE ICEP 2025
• H. Lee D. Lee J. Choi S. Jang S. E. Kim Study of Low Temperature Cu-to-Cu Bonding using Reducing Plasma Pretreatmen IEEE ICEP 2025
• J. Choi S. Jang D. Lee H. Lee S. E. Kim Optimization of PVD SiCN Deposition for Cu/SiCN Hybrid Bonding Applications IEEE ICEP 2025
• S. Jang J. Choi D. Lee H. Lee S. E. Kim Exploring the Potential of Fly Cutting for Polymer Planarization in Cu/PDMS Hybrid Bonding IEEE ICEP 2025

2024

• S. Lee S. Park S. E. Kim Utilization of Au passivation nanolayer for low-temperature Cu-to-Cu bonding IMPACT 2024
• J. Choi S. Lee S. Park S. Jang D. Lee S. Kang S. Kim S. E. Kim Characterization of PVD SiCN dielectric for Hybrid Bonding Application IMPACT 2024
• S. Jang J. Choi D. Lee S. Park S. Lee S. E. Kim Evaluation of Fly Cutting Planarization for Cu/polyimide Hybrid Bonding IMPACT 2024
• S. Park S. Lee J. Choi S. E. Kim Optimizing the Effect of O₂ Plasma on Cu Bonding for Cu Hybrid Bonding IMPACT 2024
• D. Lee J. Choi S. Jang S. E. Kim Study of Low Temperature Cu-to-Cu Bonding using Reducing Plasma Pretreatment IMPACT 2024
• S. Jang S. Lee S. Park S. E. Kim Fly Cutting for Polymer Planarization in Hybrid Cu Bonding IEEE ICEPT 2024
• S. Lee S. Park J. Choi S. E. Kim Effecst of eveposted and sputtered Au nanolayers on Cu surface for low-temperature Cu-to-Cu bonding IEEE ICEPT 2024
• S. Park S. Lee J. Choi S. E. Kim Optimization of O₂ plasma treatment on Cu surface for hybrid Cu bonding IEEE ICEPT 2024
• J. Choi S. Park S. Lee S. E. Kim Evaluation of PVD SiCN for Cu/SiCN Hybrid Bonding IEEE ICEPT 2024
• S. Lee S. Park D. Lee S. Jang J. Choi S. E. Kim E-beam evaporator 및 sputter로 증착된 Au 나노막 보호층을 이용한 저온 Cu-to-Cu 접합 연구 ISE 2024
• S. Park S. Lee J. Choi S. Jang D. Lee S. E. Kim 하이브리드 본딩을 위한 Cu 표면의 O₂ 플라즈마 전처리 조건 최적화 ISE 2024
• D. Lee S. Lee S. Park J. Choi S. Jang S. E. Kim Cu/SiO₂ 하이브리드 본딩을 위한 2단계 Ar/N₂ 플라즈마의 영향 분석 ISE 2024
• S. Jang J. Choi D. Lee S. Lee S. Park S. E. Kim Cu/Polymer 하이브리드 본딩을 위한 Polymer 평탄화 연구 ISE 2024
• J. Choi S. Lee S. Park S. Jang D. Lee S. E. Kim Cu/SiCN Hybrid Bonding을 위한 PVD SiCN 박막 특성 및 본딩 연구 ISE 2024
• S. Park S. Lee J. Choi S. E. Kim Optimization of O₂ plasma treatment on Cu surface for hybrid Cu bonding KCS 2024
• S. Lee S. Jang S. Park S. E. Kim Potential Use of Fly Cutting Method for Cu/Polymer Planarization in Hybrid Bonding 현장우수포스터상 KCS 2024
• J. Choi S. Park S. Lee S. E. Kim Evaluation of PVD SiCN for Cu/SiCN Hybrid Bonding KCS 2024
• S. Park H. Yoon C. Kim S. E. Kim W. Lee Effect of Cu Pad Density on Cu/SiCN Hybrid Bonding: A Finite Element Analysis Study KCS 2024

2023

• S. Lee S. Lee J. Choi S. E. Kim Optimization of O₂ plasma treatment on Cu surface for hybrid Cu bonding ISMP 2023
• S. Park S. Lee J. Choi S. E. Kim Characteristics of Cu Bonding Using Au Passivation Nanolayer for Low Temperature Hybrid Bonding ISMP 2023
• J. Choi S. Park S. Lee S. E. Kim Analysis of PVD SiCN film characteristics for Cu/SiCN hybrid bonding Best Paper Award ISMP 2023
• S. Park S. Lee J. Choi S. E. Kim Ar/N₂ 2-step plasma treatment on SiO₂ for hybrid bonding Best Poster Award KMEPS 2023
• S. Lee S. Park J. Choi S. E. Kim Study of Cu bonding using matel nanolayer KMEPS 2023
• S. E. Kim Recent Advances and Trends in Heterogeneous Integration (Invited Talk) KMEPS 2023
• S. Lee J. Choi G. Oh Y. Kim S. E. Kim Investigation of Cu-to-Cu and oxide-to-oxide bonding IEEE ECTC 2023
• S. E. Kim Hybrid Cu Bonding (Invited Talk) IEIE 2023
• S. Lee J. Choi G. Oh S. Park S. E. Kim Effect of particle removal on Cu and oxide surface of PR in dicing process for die-to-wafer bonding KSC 2023
• S. Park C. Kim G. Oh Y. S. Yun J. Kang S. E. Kim W. Lee Effect of Cu Pad Dimension on Cu/SiCN Hybrid Bonding Process: A Finite Element Analysis Study KSC 2023

2022

• S. Lee G. Oh S. Park Y. Kim S. E. Kim Properties of various plasma surface treatments for oxide-oxide bonding in 3D integration ISMP 2022
• G. Oh C. Kim W. Lee J. Kang J. Park Y. Yun S. E. Kim Cu/Oxide Hybrid Bonding Analysis by Finite Element Modeling ISMP 2022
• S. Park Y. Kim K. Oh S. E. Kim Cu-to-Cu bonding quality analysis through diffusion between titanium nano passivation and copper Conference KMEPS 2022
• Y. Kim S. Park S. E. Kim Analysis of Cu-Cu wafer bonding using Ag nano passivation Conference KMEPS 2022
• S. Park Y. Kim S. E. Kim Low temperature copper wafer bonding using titanium nano passivation Top Outstanding Paper Award KCS 2022
• Y. Kim S. Park S. E. Kim Low-temperature Cu-Cu wafer bonding using Ag nanolayer KCS 2022
• S. Park Y. Kim Y. Park K. Oh S. E. Kim Ni 프로브 핀에 damage가 없는 고선택비의 Cu/Ni 습식 식각 공정 KCS 2022

2021

• S. Park Y. Kim Y. Park S. E. Kim Characteristics of Ti Nano Passivation for Low Temperature Cu Bonding ISMP 2021
• Y. Park K. Oh S. Park Y. Kim S. E. Kim Highly Selective Cu Etching in Cu/Ni Layer Structures for Probe Pin Fabrication ISMP 2021
• Y. Kim S. Park S. E. Kim Low temperature Cu-Cu bonding using Ag nanolayer ISMP 2021
• Y. Kim S. Park H. Park H. Seo S. E. Kim Experimental Characterization of Cu-to-Cu Bonding Best Poster Award The Korean Conference on Semiconductor 2021
• H. Park S. Park Y. Kim S. E. Kim Cu-Cu Bonding using Optimized Copper Nitride Passivation for 3D Packaging Applications IEEE IITC 2021
• S. Park Y. Kim S. E. Kim Effect of Titanium Thin Films on Low Temperature Copper Bonding KMEPS 2021
• H. Park S. Park Y. Kim S. E. Kim Evaluation of Cu bonding using Ag nanolayer and their diffusion KMEPS 2021
• S. Choi G. Kim H. Park S. E. Kim Y. Park 3차원 직접 접합을 위한 Ar/N₂ 2단계 플라즈마 처리 조건에 따른 Cu-Cu접합 특성 평가 KMEPS 2021

2020

• H. Park H. Seo G. Kim Y. B. Park S. E. Kim Copper surface passivation for low temperature Cu-to-Cu bonding applications ECS PRiME 2020
• H. Seo H. Park S. E. Kim Study of plasma treatments and planarization process for characteristics required for wafer-level Cu-to-Cu hybrid bonding IEEE ECTC 2020
• H. Park H. Seo M. Park S. E. Kim Development of CMOS-compatible low temperature Cu bonding optimized by the response surface methodology IEEE ECTC 2020
• H. Park S. Park S. E. Kim Optimization of oxidation-free Cu bonding using the design of experiment method ENGE 2020
• H. Seo Y. Kim G. Kim Y. B. Park S. E. Kim Characterizations of copper nitride passivated surface for Cu bonding ENGE 2020
• Y. Kim S. Park H. Park S. E. Kim Copper bonding at 260oC using nitrogen plasma process KMAPS 2020
• S. Park Y. Kim H. Seo S. E. Kim Persistence analysis of copper nitride passivation for Cu bonding application KMAPS 2020
• S. Choi G. Kim H. Seo S. E. Kim Y. B. Park Quantittive interfacial adhesion energy and analysis of Ar/N₂ two-step plasma treatment for low temperature Cu direct bonding KMAPS 2020
• S. Park Y. Kim H. Park S. E. Kim A study of Cu bonding using copper nitride for 3D packaging ISE 2020

2019

• S. E. Kim Plasma process optimization for Cu bonding integration using the design of experiment technique IEEE EPTC 2019
• H. Seo H. Park and S. E. Kim Comparative Study of Plasma Treatment on Sputtered and Electroplated Cu Surfaces for Cu-to-Cu Bonding Best Poster Award ISMP-EMAP 2019
• G. Kim K. Son H. Seo S. E. Kim Y. Park Copper Nitride Passivation by Ar-N₂ Two Step Plasma Treatments for Low-Temperature Copper Bonding ISMP-EMAP 2019
• H. Park H. Seo and S. E. Kim Ar/N2 plasma treatment effect on qualtitative interfacial adhesion energy of sputtered Cu direct bonding for 3D integration ISMP-EMAP 2019
• H. Seo H. Park and S. E. Kim Effects of argon and nitrogen ion bombardments on sputtered and electroplated Cu surfaces for Cu boning application IEEE 3DIC
• H. Park H. Seo and S. E. Kim Characterization of nitride passivaed Cu surface for low temperature Cu-Cu bonding IEEE 3DIC
• H. Park H. Seo and S. E. Kim Effect of nitride passivation on Cu surface for low temperature Cu-to-Cu bonding IEEE LTB-3D
• H. Park S. E. Kim Study of Ar-N₂ plasma treated Cu surface for low temperature Cu-Cu wafer bonding KCS 2019

2018

• H. Park and S. E. Kim Effect of Ar-N₂ Plasma Treatment on Copper Surface for Cu-Cu Wafer Bonding Best Interactive Poster Award IEEE EPTC 2018
• C. Song S. Kim and S. E. Kim Study of polysilsesquioxane dielectric for the use of multi-structured redistribution layers in fan-out wafer level packaging applications IEEE EPTC 2018
• H. Park and S. E. Kim Characterization of Cu surfaces by plasma treatment for wafer bonding applications ISMP 2018
• C. Song S. Kim and S. E. Kim Synthesis and characterization of positive-type spin-on hybrid material for dielectric application in fan out wafer level packaging Best Poster award ISMP 2018
• C. Song S. Kim and S. E. Kim Study of photo-definable organic-inorganic spin-on dielectric use for FOWLP applications IUMRS-ICEM 2018
• H. Park and S. E. Kim Study of plasma treated Cu surface for Cu wafer bonding applications IUMRS-ICEM 2018
• C. Song S. Kim and S. E. Kim Fabrication and characteristics of spin-on glass for multi-level interconnect in WLP IEEE ECTC 2018
• C. Song S. Kim and S. E. Kim Study on photodefinable hybrid dielectrics for WLP applications KMAPS 2018
• C. Song S. Kim and S. E. Kim Evaluation of spin-on glass for a dielectric use in multilayer wafer level packaging KCS 2018
• S. Cho S. Kim and S. E. Kim Effect of Si mechanical grinding on the electrical properties of oxide semiconductor thin film on Si substrate KCS 2018

2017

• C. Song S. Kim and S. E. Kim Process Assessment of Spin-On-Glass in Wafer Level Packaging Interconnect KMRS-F 2017
• S. Cho S. Kim and S. E. Kim Influence of different Si substrate thicknesses on electrical properties of p-channel SnO TFT KMRS-F 2017
• C. Song S. Kim and S. E. Kim Evaluation of spin-on dielectric for use in wafer level packaging interconnect ISMP 2017
• S. Cho C. Kim S. Kim and S. E. Kim Effect of Si substrate thickness on electrical properties of p-channel SnO TFT ISMP 2017
• J. Pyun S. Hanm S. E. Kim and S. Kim Planarization characteristics of polymer interlayer dielectricfor FOWLP applications ISMP 2017
• C. Song J. Pyun S. Han S. Kim and S. E. Kim Effect of wet etching on various barrier materials for fine pitch redistribution layers KMRS-S 2017
• S. Cho C. Kim S. Kim and S. E. Kim Influence of different targets on electrical, optical, and structural properties of sputter deposited thin oxide thin films KMRS-S 2017
• C. Song J. Pyun S. Han S. Kim and S. E. Kim Study of sputtered Ti/Cu barrier/seed etching for fine pitch EDG structures KMAPS 2017
• K. Oh C. Yoon J. Son and S. E. Kim Warpage characteristic analysis on packaged chip after thermocompression reliability test KMAPS 2017
• Y. Won and S. E. Kim Micro-fabrication of Si liquid cooling structure and its thermal characteristic analysis Best Poster Award KCS 2017
• C. Kim S. Kim and S. E. Kim The effect of annealing on the structural and electrical properties of sputter-deposited SnOx thin films by a composite target KCS 2017

2016

• C. Kim Y. Won S. Kim and S. E. Kim Effect of vacuum annealing on transparent SnOx thin films produced by sputtering of SnO/Sn composite target TCN 2016
• C. Kim Y. Won S. Kim and S. E. Kim Comparative analysis of SnOx thin films deposited by reactive sputtering in different SnO/Sn target compositions TCM 2016
• Y. Wom S. Kim and S. E. Kim Single-phase liquid cooling of silicon chips for high power density microelectronics ISMP 2016
• Y. Nam S. E. Kim and S. Kim Hydrogen plasma treatment of Cu oxide for Cu-Cu direct bonding application ISMP 2016
• Y. Won S. Kim, and S. E. Kim Characteristics of micro-channel liquid cooling system with various metal heat spreaders and coolants KCS 2016
• C. Kim S. Kim and S. E. Kim Characterization of p-type SnO thin films with SnO/Sn composite target for transparent device applications KCS 2016
• Y. Won S. Kim and S. E. Kim Effects of micro-channel liquid cooling with Cu or Ag bumps for IC thermal management Best Poster Award KMRS 2016
• C. Kim S. Kim and S. E. Kim Effects of SnO/Sn composite target on rf reactive sputtered p-type SnO thin films KMRS 2016

2015

• Y. Shin J. Ma S. Kim and S. E. Kim 3D IC thermal management using Cu filled TSVs KSC 2015
• M. Park S. Baek S. Kim and S. E. Kim Liquid cooling system with TSV for high power 3D packages Best Poster Award KCS 2015
• Y. Won S. E. Kim The characteristics of liquid cooling module fabricated on Si wafer with micro-channel and TSV KMRAS 2015
• C. Kim S. E. Kim Structural, electrical. and optical properties of SnO thin film grown by RF sputtering of SnO /Sn composite target Best Poster Award KMRS 2015
• M. Park S. Kim and S. E. Kim Experimental characterization of TSV liquid cooling for 3D integration IITC MAM 2015
• C. Kim S. Kim and S. E. Kim Tin oxide deposited via RF sputtering with SnO/Sn composite target ISMP 2015
• Y. Won M. Park S. Kim and S. E. Kim Fabrication of on-chip liquid cooling system for 3D IC thermal management Best Poster Award ISMP 2015
• Y. Won M. Park S. Kim and S. E. Kim On-Chip liquid cooling solution for high power IC devices ADMETA 2015

2014

• C. Kim S. E. Kim Stability study of p-type SnO thin film deposited by reactive rf sputtering KMRS 2014
• J.M. Park S. Baek S. E. Kim Direct wafer cooling evaluation with TSV and Si micro-channels KMRS 2014
• C. Kim S. Kim S. E. Kim Reliability evaluation of p-type SnO thin film deposited on Si substrate of various thickness KMAPS 2014
• S. Bae M. Park S. Kim S. E. Kim Experimental study of liquid cooling system with TSV and micro-channels KMAPS 2014
• S. Kim S. E. Kim S. Kim High volume manufacturing challenges and opportunities for wafer level vertical interconnection KMAPS 2014
• Y. Shin J. Ma S. E. Kim S. Kim THermal management study for hot spot cooling in 3D ICs KMAPS 2014
• Y. Nam S. E. Kim S. Kim Effect of surface plasma treatment using forming gas on Cu direct bonding KMAPS 2014
• M. Park S. Baek S. Kim S. E. Kim Surface plasma treatment of Cu interconnect for Cu bonding in 3D integration and their characteristics IUMRS 2014
• M. Park J. Ma S. Naek S. Kim S. E. Kim Development of TSV liquid cooling structure for 3D integration IUMRS 2014
• S. Kim Y. SHin J. Lee S. E. Kim S. Kim Wafer level Cu-Cu direct bonding with TSV in 3D integration IUMRS 2014

2013

• J. Um S. E. Kim homojunction pn diode using tin oxide nanocrystalline thin film deposited via sputtering ICSS 2013
• J. Ma S. Shin S. E. Kim Characterization of micro flip-chip ABL structure for high power IC devices ICSS 2013
• I. Song M. Lee S. E. Kim S. Kim Development of Cu CMP process for Cu-to-Cu wafer stacking Best Poster Award EMAP 2013
• S. Shin S. H. Kim S. E. Kim S. Kim Evaluation of wafer warpage in 3D stacking technology EMAP 2013
• M. Park S. H. Kim J. Ma S. Shin I. Song M. Lee S. Y. Kim S. Kim S. E. Kim Characterization and fabrication of wafer level 3D stacking EMAP 2013
• J. Ma S. Shin S. Kim S. E. Kim Feasibility of micro ABL bumps with flip chip process for high power devices and 3D interconnection KMAPS 2013
• M. Lee S. E. Kim S. Kim Assessment of wafer level Cu-Cu bonding process Best Poster Award KMAPS 2013
• S. E. Kim Challenges of 3D IC manufacturing KSPE 2013
• J. Um S.E. Kim Properties of annealed tin oxide thin films and their homojunction pn diode application KMRS 2013
• M. Park S. E. Kim Study of Ar plasma treatment on Cu interconnect surface for Cu bonding in 3D integration Best Poster Award KMRS 2013