2025
- S. Jang J. Choi D. Lee H. Lee S. E. Kim Evaluation of Fly Cutting for Planarization in Cu/Polymer Hybrid Bonding and Its Effects on Polymer Materials and Processing Conditions ICEPT 2025
- J. Choi S. Jang D. Lee H. Lee S. E. Kim Study on the deposition and low-temperature bonding of PVD SiCN thin film ICEPT 2025
- S. Kim K. Seo J. Choi S. Jang D. Lee H. Lee S. E. Kim Study on Cu Dishing in CMP Process and Its Impact on Hybrid Bonding by Pad Size ICEPT 2025
- H. Lee D. Lee S. Jang J. Choi S. E. Kim Effect of CH4 Plasma Pretreatment on Cu-to-Cu Bonding Applications ICEPT 2025
- D. Lee J. Choi S. Jang H. Lee K. Komamura S. E. Kim Effect of Palladium Passivation via Electroplating and Electroless Plating on Low-Temperature Cu-to-Cu Bonding ICEPT 2025
- S. Jang JJ. Choi D. Lee H. Lee S. E. Kim Optimization of Fly Cutting Process for Cu/Polyimide Hybrid Bonding KCS 2025
- J. Choi S. Jang D. Lee H. Lee S. E. Kim Characterization of PVD SiCN Thin Films for Chip Stacking KCS 2025
- S. kim,.K. Seo H. Lee S. Park S. E. Kim Study of Cu Dishing After Cu CMP Based on Pad Layouts and Its Impact on Hybrid Bonding KCS 2025
- D. Lee H. Lee J. Choi S. Jang S. E. Kim Study of Low Temperature Cu-to-Cu Bonding using Reducing Plasma Pretreatment KCS 2025
- D. Lee J. Choi S. Jang H. Lee S. E. Kim Effect of Noble Metal Passivation Deposited by ECD on Cu Surface for Low-Temperature Cu-to-Cu Bonding IEEE ICEP 2025
- H. Lee D. Lee J. Choi S. Jang S. E. Kim Study of Low Temperature Cu-to-Cu Bonding using Reducing Plasma Pretreatmen IEEE ICEP 2025
- J. Choi S. Jang D. Lee H. Lee S. E. Kim Optimization of PVD SiCN Deposition for Cu/SiCN Hybrid Bonding Applications IEEE ICEP 2025
- S. Jang J. Choi D. Lee H. Lee S. E. Kim Exploring the Potential of Fly Cutting for Polymer Planarization in Cu/PDMS Hybrid Bonding IEEE ICEP 2025