2024
- S. Park S. Lee J. Choi S. E. Kim Optimization of O2 plasma treatment on Cu surface for hybrid Cu bonding KCS 2024
- S. Lee S. Jang S. Park S. E. Kim Potential Use of Fly Cutting Method for Cu/Polymer Planarization in Hybrid Bonding KCS 2024
- J. Choi S. Park S. Lee S. E. Kim Evaluation of PVD SiCN for Cu/SiCN Hybrid Bonding KCS 2024
- S. Park H. Yoon C. Kim S. E. Kim W. Lee Effect of Cu Pad Density on Cu/SiCN Hybrid Bonding: A Finite Element Analysis Study KCS 2024