2022
  • S. Park Y. Kim K. Oh S. E. Kim Cu-to-Cu bonding quality analysis through diffusion between titanium nano passivation and copper Conference KMEPS 2022
  • Y. Kim S. Park S. E. Kim Analysis of Cu-Cu wafer bonding using Ag nano passivation Conference KMEPS 2022
  • S. Park Y. Kim S. E. Kim Low temperature copper wafer bonding using titanium nano passivation KCS 2022
  • Y. Kim S. Park S. E. Kim Low-temperature Cu-Cu wafer bonding using Ag nanolayer KCS 2022
  • S. Park Y. Kim Y. Park K. Oh S. E. Kim Ni 프로브 핀에 damage가 없는 고선택비의 Cu/Ni 습식 식각 공정 KCS 2022
  • S. Park Y. Kim Y. Park S. E. Kim Characteristics of Ti Nano Passivation for Low Temperature Cu Bonding ISMP 2021
  • Y. Park K. Oh S. Park Y. Kim S. E. Kim Highly Selective Cu Etching in Cu/Ni Layer Structures for Probe Pin Fabrication ISMP 2021
  • Y. Kim S. Park S. E. Kim Low temperature Cu-Cu bonding using Ag nanolayer ISMP 2021
2021
  • Y. Kim S. Park H. Park H. Seo S. E. Kim Experimental Characterization of Cu-to-Cu Bonding Best Poster Award The Korean Conference on Semiconductor 2021
  • H. Park S. Park Y. Kim S. E. Kim Cu-Cu Bonding using Optimized Copper Nitride Passivation for 3D Packaging Applications IEEE IITC 2021
  • S. Park Y. Kim S. E. Kim Effect of Titanium Thin Films on Low Temperature Copper Bonding KMEPS 2021
  • H. Park S. Park Y. Kim S. E. Kim Evaluation of Cu bonding using Ag nanolayer and their diffusion KMEPS 2021
  • S. Choi G. Kim H. Park S. E. Kim Y. Park 3차원 직접 접합을 위한 Ar/N2 2단계 플라즈마 처리 조건에 따른 Cu-Cu접합 특성 평가 KMEPS 2021
2020
  • H. Park H. Seo G. Kim Y. B. Park S. E. Kim Copper surface passivation for low temperature Cu-to-Cu bonding applications ECS PRiME 2020
  • H. Seo H. Park S. E. Kim Study of plasma treatments and planarization process for characteristics required for wafer-level Cu-to-Cu hybrid bonding IEEE ECTC 2020
  • H. Park H. Seo M. Park S. E. Kim Development of CMOS-compatible low temperature Cu bonding optimized by the response surface methodology IEEE ECTC 2020
  • H. Park S. Park S. E. Kim Optimization of oxidation-free Cu bonding using the design of experiment method ENGE 2020
  • H. Seo Y. Kim G. Kim Y. B. Park S. E. Kim Characterizations of copper nitride passivated surface for Cu bonding ENGE 2020
  • Y. Kim S. Park H. Park S. E. Kim Copper bonding at 260oC using nitrogen plasma process KMAPS 2020
  • S. Park Y. Kim H. Seo S. E. Kim Persistence analysis of copper nitride passivation for Cu bonding application KMAPS 2020
  • S. Choi G. Kim H. Seo S. E. Kim Y. B. Park Quantittive interfacial adhesion energy and analysis of Ar/N2 two-step plasma treatment for low temperature Cu direct bonding KMAPS 2020
  • S. Park Y. Kim H. Park S. E. Kim A study of Cu bonding using copper nitride for 3D packaging ISE 2020
2019
  • S. E. Kim Plasma process optimization for Cu bonding integration using the design of experiment technique IEEE EPTC 2019
  • H. Seo H. Park and S. E. Kim Comparative Study of Plasma Treatment on Sputtered and Electroplated Cu Surfaces for Cu-to-Cu Bonding Best Poster Award ISMP-EMAP 2019
  • G. Kim K. Son H. Seo S. E. Kim Y. Park Copper Nitride Passivation by Ar-N2 Two Step Plasma Treatments for Low-Temperature Copper Bonding ISMP-EMAP 2019
  • H. Park H. Seo and S. E. Kim Ar/N2 plasma treatment effect on qualtitative interfacial adhesion energy of sputtered Cu direct bonding for 3D integration ISMP-EMAP 2019
  • H. Seo H. Park and S. E. Kim Effects of argon and nitrogen ion bombardments on sputtered and electroplated Cu surfaces for Cu boning application IEEE 3DIC
  • H. Park H. Seo and S. E. Kim Characterization of nitride passivaed Cu surface for low temperature CU-Cu bonding IEEE 3DIC
  • H. Park H. Seo and S. E. Kim Effect of nitride passivation on Cu surface for low temperature Cu-to-Cu bonding IEEE LTB-3D
  • H. Park S. E. Kim Study of Ar-N2 plasma treated Cu surface for low temperature Cu-Cu wafer bonding KCS 2019
2018
  • H. Park and S. E. Kim Effect of Ar-N2 Plasma Treatment on Copper Surface for Cu-Cu Wafer Bonding Best Interactive Poster Award IEEE EPTC 2018
  • C. Song S. Kim and S. E. Kim Study of polysilsesquioxane dielectric for the use of multi-structured redistribution layers in fan-out wafer level packaging applications IEEE EPTC 2018
  • H. Park and S. E. Kim Characterization of Cu surfaces by plasma treatment for wafer bonding applications ISMP 2018
  • C. Song S. Kim and S. E. Kim Synthesis and characterization of positive-type spin-on hybrid material for dielectric application in fan out wafer level packaging Best Poster award ISMP 2018
  • C. Song S. Kim and S. E. Kim Study of photo-definable organic-inorganic spin-on dielectric use for FOWLP applications IUMRS-ICEM 2018
  • H. Park and S. E. Kim Study of plasma treated Cu surface for Cu wafer bonding applications IUMRS-ICEM 2018
  • C. Song S. Kim and S. E. Kim Fabrication and characteristics of spin-on glass for multi-level interconnect in WLP IEEE ECTC 2018
  • C. Song S. Kim and S. E. Kim Study on photodefinable hybrid dielectrics for WLP applications KMAPS 2018
  • C. Song S. Kim and S. E. Kim Evaluation of spin-on glass for a dielectric use in multilayer wafer level packaging KCS 2018
  • S. Cho S. Kim and S. E. Kim Effect of Si mechanical grinding on the electrical properties of oxide semiconductor thin film on Si substrate KCS 2018
2017
  • C. Song S. Kim and S. E. Kim Process Assessment of Spin-On-Glass in Wafer Level Packaging Interconnect KMRS-F 2017
  • S. Cho S. Kim and S. E. Kim Influence of different Si substrate thicknesses on electrical properties of p-channel SnO TFT KMRS-F 2017
  • C. Song S. Kim and S. E. Kim Evaluation of spin-on dielectric for use in wafer level packaging interconnect ISMP 2017
  • S. Cho C. Kim S. Kim and S. E. Kim Effect of Si substrate thickness on electrical properties of p-channel SnO TFT ISMP 2017
  • J. Pyun S. Hanm S. E. Kim and S. Kim Planarization characteristics of polymer interlayer dielectricfor FOWLP applications ISMP 2017
  • C. Song J. Pyun S. Han S. Kim and S. E. Kim Effect of wet etching on various barrier materials for fine pitch redistribution layers KMRS-S 2017
  • S. Cho C. Kim S. Kim and S. E. Kim Influence of different targets on electrical, optical, and structural properties of sputter deposited thin oxide thin films KMRS-S 2017
  • C. Song J. Pyun S. Han S. Kim and S. E. Kim Study of sputtered Ti/Cu barrier/seed etching for fine pitch EDG structures KMAPS 2017
  • K. Oh C. Yoon J. Son and S. E. Kim Warpage characteristic analysis on packaged chip after thermocompression reliability test KMAPS 2017
  • Y. Won and S. E. Kim Micro-fabrication of Si liquid cooling structure and its thermal characteristic analysis Best Poster Award KCS 2017
  • C. Kim S. Kim and S. E. Kim The effect of annealing on the structural and electrical properties of sputter-deposited SnOx thin films by a composite target KCS 2017
2016
  • C. Kim Y. Won S. Kim and S. E. Kim Effect of vacuum annealing on transparent SnOx thin films produced by sputtering of SnO/Sn composite target TCN 2016
  • C. Kim Y. Won S. Kim and S. E. Kim Comparative analysis of SnOx thin films deposited by reactive sputtering in different SnO/Sn target compositions TCM 2016
  • Y. Wom S. Kim and S. E. Kim Single-phase liquid cooling of silicon chips for high power density microelectronics ISMP 2016
  • Y. Nam S. E. Kim and S. Kim Hydrogen plasma treatment of Cu oxide for Cu-Cu direct bonding application ISMP 2016
  • Y. Won S. Kim, and S. E. Kim Characteristics of micro-channel liquid cooling system with various metal heat spreaders and coolants KCS 2016
  • C. Kim S. Kim and S. E. Kim Characterization of p-type SnO thin films with SnO/Sn composite target for transparent device applications KCS 2016
  • Y. Won S. Kim and S. E. Kim Effects of micro-channel liquid cooling with Cu or Ag bumps for IC thermal management Best Poster Award KMRS 2016
  • C. Kim S. Kim and S. E. Kim Effects of SnO/Sn composite target on rf reactive sputtered p-type SnO thin films KMRS 2016
2015
  • Y. Shin J. Ma S. Kim and S. E. Kim 3D IC thermal management using Cu filled TSVs KSC 2015
  • M. Park S. Baek S. Kim and S. E. Kim Liquid cooling system with TSV for high power 3D packages Best Poster Award KCS 2015
  • Y. Won S. E. Kim The characteristics of liquid cooling module fabricated on Si wafer with micro-channel and TSV KMRAS 2015
  • C. Kim S. E. Kim Structural, electrical. and optical properties of SnO thin film grown by RF sputtering of SnO /Sn composite target Best Poster Award KMRS 2015
  • M. Park S. Kim and S. E. Kim Experimental characterization of TSV liquid cooling for 3D integration IITC MAM 2015
  • C. Kim S. Kim and S. E. Kim Tin oxide deposited via RF sputtering with SnO/Sn composite target ISMP 2015
  • Y. Won M. Park S. Kim and S. E. Kim Fabrication of on-chip liquid cooling system for 3D IC thermal management Best Poster Award ISMP 2015
  • Y. Won M. Park S. Kim and S. E. Kim On-Chip liquid cooling solution for high power IC devices ADMETA 2015
2014
  • C. Kim S. E. Kim Stability study of p-type SnO thin film deposited by reactive rf sputtering KMRS 2014
  • J.M. Park S. Baek S. E. Kim Direct wafer cooling evaluation with TSV and Si micro-channels KMRS 2014
  • C. Kim S. Kim S. E. Kim Reliability evaluation of p-type SnO thin film deposited on Si substrate of various thickness KMAPS 2014
  • S. Bae M. Park S. Kim S. E. Kim Experimental study of liquid cooling system with TSV and micro-channels KMAPS 2014
  • S. Kim S. E. Kim S. Kim High volume manufacturing challenges and opportunities for wafer level vertical interconnection KMAPS 2014
  • Y. Shin J. Ma S. E. Kim S. Kim THermal management study for hot spot cooling in 3D ICs KMAPS 2014
  • Y. Nam S. E. Kim S. Kim Effect of surface plasma treatment using forming gas on Cu direct bonding KMAPS 2014
  • M. Park S. Baek S. Kim S. E. Kim Surface plasma treatment of Cu interconnect for Cu bonding in 3D integration and their characteristics IUMRS 2014
  • M. Park J. Ma S. Naek S. Kim S. E. Kim Development of TSV liquid cooling structure for 3D integration IUMRS 2014
  • S. Kim Y. SHin J. Lee S. E. Kim S. Kim Wafer level Cu-Cu direct bonding with TSV in 3D integration IUMRS 2014
2013
  • J. Um S. E. Kim homojunction pn diode using tin oxide nanocrystalline thin film deposited via sputtering ICSS 2013
  • J. Ma S. Shin S. E. Kim Characterization of micro flip-chip ABL structure for high power IC devices ICSS 2013
  • I. Song M. Lee S. E. Kim S. Kim Development of Cu CMP process for Cu-to-Cu wafer stacking Best Poster Award EMAP 2013
  • S. Shin S. H. Kim S. E. Kim S. Kim Evaluation of wafer warpage in 3D stacking technology EMAP 2013
  • M. Park S. H. Kim J. Ma S. Shin I. Song M. Lee S. Y. Kim S. Kim S. E. Kim Characterization and fabrication of wafer level 3D stacking EMAP 2013
  • J. Ma S. Shin S. Kim S. E. Kim Feasibility of micro ABL bumps with flip chip process for high power devices and 3D interconnection KMAPS 2013
  • M. Lee S. E. Kim S. Kim Assessment of wafer level CU-Cu bonding process Best Poster Award KMAPS 2013
  • S. E. Kim Challenges of 3D IC manufacturing KSPE 2013
  • J. Um S.E. Kim Properties of annealed tin oxide thin films and their homojunction pn diode application KMRS 2013
  • M. Park S. E. Kim Study of Ar plasma treatment on Cu interconnect surface for Cu bonding in 3D integration Best Poster Award KMRS 2013